Description
The Teledyne Teledyne FLIR Boson+ 22320H092-6PAAX represents a cutting-edge OEM thermal imaging core engineered for demanding embedded vision applications. Its 320×256 microbolometer array operates in the 8-14 µm long-wave infrared (LWIR) spectrum, capturing detailed heat signatures with industry-leading sensitivity of ≤20 mK. This enables reliable detection, recognition, and identification of objects and anomalies even in challenging environmental conditions.
Architected for minimal latency and high throughput, the module leverages Teledyne FLIR’s proprietary DDE+ image processing and Silent Shutterless NUC (SSN™) technology to deliver stable, high-contrast video feeds without the motion artifacts of mechanical shutters. The combination of a wide 92° field of view, digital zoom up to 8x, and a dynamic range up to 350°C makes it exceptionally versatile for scenarios requiring broad area monitoring or focused inspection.
Designed with system integrators in mind, the Boson+ core supports a suite of standard digital interfaces—including USB for direct connectivity, CMOS for parallel data, and MIPI CSI-2 for streamlined integration with modern SoCs. Its robust -40°C to +80°C operating temperature range and low 3.3V DC power requirement ensure reliable performance in outdoor, mobile, and industrial environments, from autonomous drones to predictive maintenance systems.
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