TDK InvenSense ICM-20689 6-Axis MEMS IMU Motion Sensor Module - I2C/SPI Interface
The TDK InvenSense ICM-20689 is a high-performance 6-axis MEMS IMU module integrating a 3-axis gyroscope and a 3-axis accelerometer, designed for precision motion tracking in drones, robotics, and wearable devices. It features a wide programmable full-scale range, a 4KB FIFO buffer, and supports both I2C (400kHz) and SPI (8MHz) communication for flexible integration with microcontrollers like Arduino, Raspberry Pi, and STM32.
Features
- Integrated 6-axis MEMS IMU with 3-axis gyroscope and 3-axis accelerometer.
- Programmable Full-Scale Ranges: Gyro (±250°/s to ±2000°/s), Accel (±2g to ±16g).
- On-chip 4KB FIFO buffer for reduced host processor load and power consumption.
- Dual digital interfaces: 8MHz SPI and 400kHz I2C for flexible system integration.
- Low operating voltage range from 1.71V to 3.45V, suitable for battery-powered applications.
Out of stock
The ICM-20689 motion sensor module leverages TDK InvenSense’s advanced MEMS fabrication and proprietary Digital Motion Processorâ„¢ (DMP) to deliver highly accurate angular rate and linear acceleration data. The integrated 16-bit ADC ensures high-resolution signal conversion, while programmable digital filters allow for noise reduction tailored to specific application bandwidths.
Designed for demanding environments, the module operates across an extended temperature range and features a compact QFN package footprint. The inclusion of a built-in temperature sensor aids in thermal compensation, maintaining measurement accuracy. User-configurable interrupts and a dynamic wake-up function enable efficient, event-driven system architectures ideal for power-sensitive mobile and IoT designs.
Additional Information
| Weight | 0.002 kg |
|---|---|
| Dimensions | 1.8 × 1.3 cm |
