SKU: SENS-1092
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ADXL375 3-Axis Digital Accelerometer Module - ±200g Range, SPI/I2C Interface

₹1,649.00 (Inclusive of all taxes)
Out of Stock

The ADXL375 is a high-g, 3-axis digital accelerometer module with a ±200g measurement range and 10,000g shock survivability. It provides 16-bit digital output via SPI or I2C interfaces, making it compatible with microcontrollers like Arduino, Raspberry Pi, ESP32, and industrial PLCs for impact detection and vibration monitoring.

Features

  • Ultra-wide ±200g measurement range for high-shock applications
  • Exceptional 10,000g impact resistance for rugged environments
  • Ultra-low power consumption: 35 µA in measurement mode, 0.1 µA standby
  • Digital output via selectable SPI (3-wire/4-wire) or I2C interface
  • Integrated 32-level FIFO buffer reduces host processor load

Out of stock

Description

The ADXL375 3-Axis Acceleration Module is a MEMS-based digital sensor engineered for precise measurement of high-g forces, impacts, and vibrations. Its capacitive sensing principle delivers a 16-bit digital output, ensuring accurate data capture across its full ±200g dynamic range. The module includes built-in signal conditioning and temperature compensation for stable performance from –40°C to +85°C.

Designed for system efficiency, it features a 32-sample FIFO buffer and programmable data rates up to 1 kHz bandwidth, minimizing communication overhead. The selectable SPI and I2C digital interfaces allow seamless integration into embedded control systems, data loggers, and condition monitoring platforms, providing reliable motion data in demanding industrial and automotive environments.

Key Features

  • High-g MEMS accelerometer with ±200g full-scale range
  • Ruggedized design withstands shocks up to 10,000g
  • Optimized for low-power operation: 35 µA typical at 2.0V supply
  • Flexible digital communication via SPI (3-wire/4-wire) or I2C
  • 32-level output data FIFO for efficient host processor management
  • Programmable measurement bandwidth from 0.5 Hz to 1 kHz
  • Integrated motion detection (active/inactive) and free-fall sensing
  • Compact, RoHS-compliant LGA package (3×5×1 mm sensor) on breakout module

Applications

  • High-impact event detection in automotive crash recorders and black boxes
  • Vibration monitoring and predictive maintenance in industrial machinery
  • Motion and tilt sensing in ruggedized robotics and unmanned vehicles
  • Shock and drop detection for asset tracking and equipment monitoring
  • Sports analytics and biomechanics for high-force athletic movements

Technical Specifications

Item Type3-Axis Digital Accelerometer Module
Model NumberADXL375
Operating Voltage2.0 VDC to 3.6 VDC
I/O Voltage Range1.7 V to VS
Sensing Range±200 g
Shock Survivability10,000 g
Output TypeDigital (SPI / I2C)
Output Resolution16-bit
Current Consumption (Measurement)35 µA (typical)
Current Consumption (Standby)0.1 µA (typical)
Operating Temperature–40 °C to +85 °C
Module Dimensions (L x W)24 mm x 13 mm
Module Weight3 g

Frequently Asked Questions

What is the operating voltage range for the ADXL375 module?

The ADXL375 requires a supply voltage between 2.0V and 3.6V DC. The digital I/O pins are compatible with a voltage range from 1.7V up to the supply voltage (VS), allowing flexible interfacing with 1.8V, 3.0V, or 3.3V logic microcontrollers.

How do I communicate with the ADXL375 sensor: SPI or I2C?

The ADXL375 supports both SPI (3-wire or 4-wire modes) and I2C digital communication protocols. The interface is selected by configuring the CS (Chip Select) pin. For I2C mode, CS should be tied high; for SPI mode, it is used as the active-low chip select line.

What is the purpose of the FIFO buffer in the ADXL375?

The integrated 32-level FIFO buffer stores acceleration samples, allowing the host processor to read data in bursts. This significantly reduces the required polling rate and system power consumption, making it ideal for battery-powered data logging and event-triggered systems.

Can this sensor be used for vibration analysis?

Yes, the ADXL375's ±200g range, programmable bandwidth up to 1 kHz, and 16-bit output make it suitable for capturing high-frequency vibration signatures. It is commonly used in industrial condition monitoring, machinery health assessment, and structural vibration analysis.

What is the physical size of the sensor and the module?

The ADXL375 MEMS die is housed in a compact 3 mm x 5 mm x 1 mm LGA package. The provided breakout module measures approximately 24 mm in length and 13 mm in width, offering accessible pin headers for easy prototyping and integration.

Package Includes

  • 1 x ADXL375 3-Axis Acceleration Module

Additional Information

Weight 0.003 kg
Dimensions 2.4 × 1.3 cm