Teledyne Teledyne FLIR Hadron 640+ Dual Thermal & Visible Camera Module, 640×512 LWIR + 64MP EO
The Teledyne Teledyne FLIR Hadron 640+ is a compact dual-sensor OEM camera core integrating a 640×512 LWIR thermal imager with a 64MP visible CMOS sensor. Designed for AI-driven robotics and UAV platforms, it provides MIPI and USB 3.0 interfaces for seamless integration with NVIDIA Jetson and Qualcomm processors.
Features
- Dual-Sensor Imaging: Combines a high-resolution 640×512 LWIR thermal sensor with a 64MP visible CMOS camera for comprehensive scene analysis and AI-driven object detection.
- SWaP-Optimized Design: Compact, lightweight, and low-power module ideal for integration into drones, robotics, and portable industrial inspection systems.
- High-Performance Interfaces: Features MIPI CSI-2 and USB 3.0 data outputs alongside I2C/SPI control for flexible integration with popular embedded AI platforms like NVIDIA Jetson.
- Robust Environmental Protection: IP54-rated sealed enclosure ensures reliable operation in dusty or humid conditions typical of outdoor and industrial deployments.
- Global Deployment Ready: ITAR-free and NDAA-compliant design allows for worldwide commercial and industrial use in security, automation, and remote sensing applications.
Out of stock
The Teledyne Teledyne FLIR Hadron 640+ represents a significant advancement in embedded vision, merging high-resolution long-wave infrared (LWIR) and visible light imaging into a single, compact OEM module. Its core houses the Teledyne FLIR Boson+ thermal sensor with a 12 µm pixel pitch and a paired 64.2-megapixel electro-optical (EO) sensor, enabling simultaneous capture of detailed thermal data and ultra-high-definition visible imagery. This dual-stream capability is critical for advanced perception systems requiring both spectral analysis and visual context.
Engineered for Size, Weight, and Power (SWaP) optimization, the module is built for direct integration into constrained platforms such as unmanned aerial vehicles (UAVs), autonomous mobile robots (AMRs), and handheld inspection tools. It supports AI and machine learning workflows through Teledyne FLIR’s Prism software ecosystem, accelerating the development of applications in predictive maintenance, automated inspection, and intelligent surveillance. The module’s standardized MIPI and USB 3.0 interfaces ensure plug-and-play compatibility with leading edge AI processors, simplifying system architecture and reducing time-to-market for complex vision solutions.
Additional Information
| Weight | 0.15 kg |
|---|---|
| Dimensions | 10 × 12 × 8 cm |
