Seeed Studio Studio XIAO nRF54L15 BLE 6.0 Matter Thread SoC
The Seeed Studio Studio XIAO nRF54L15 is a thumb-sized, ultra-low-power development board built on the Nordic Semiconductor nRF54L15 SoC, featuring a 128 MHz Arm Cortex-M33 core, RISC-V security coprocessor, and multi-protocol wireless support for BLE 6.0, Matter, Thread, Zigbee, and Amazon Sidewalk. It is designed for rapid prototyping and production-ready integration of next-generation IoT, wearable, and smart home devices.
Features
- Nordic Semiconductor nRF54L15 SoC with 128 MHz Arm Cortex-M33 core and dedicated RISC-V security coprocessor for secure, high-performance edge computing.
- Multi-protocol wireless connectivity supporting BLE 6.0, Matter, Thread, Zigbee, and Amazon Sidewalk for versatile IoT ecosystem integration.
- Ultra-low power architecture achieving ~0.6 µA in System OFF mode, ideal for battery-powered wearable and sensor applications.
- PCBA-ready SMD design with stamp hole footprint for direct surface-mount integration into final products.
- Integrated USB Type-C for programming and power, plus onboard Li-ion battery charging support for portable deployments.
Out of stock
The Seeed Studio Studio XIAO nRF54L15 is a compact, feature-rich development platform engineered for the next wave of secure and connected IoT devices. At its core is the Nordic Semiconductor Semiconductor nRF54L15 system-on-chip, which combines a high-performance 128 MHz Arm Cortex-M33 application processor with a dedicated RISC-V coprocessor for hardware-enforced security tasks. This dual-core architecture enables complex on-device processing, such as sensor fusion and TinyML inference, while maintaining robust protection against physical and remote attacks.
Its wireless transceiver is a standout, natively supporting the latest Bluetooth Low Energy 6.0 standard alongside the Thread mesh networking protocol, Zigbee, and the new Matter application layer. This allows a single device to function as a border router, end-device, or bridge within heterogeneous smart home and industrial networks. The board’s exceptional power efficiency, with deep sleep currents in the sub-microamp range, is engineered for years of operation on a single coin cell or small Li-ion battery.
The form factor is a 21 x 17.8 mm surface-mount module with castellated “stamp hole” edges, making it a true production-ready component. Developers can prototype using the provided headers and then seamlessly transition the same design to a custom PCB for volume manufacturing. Full software support is provided through the nRF Connect SDK and Zephyr RTOS, with compatibility for PlatformIO and Arduino frameworks, accelerating development from concept to deployment.
Additional Information
| Weight | 0.003 kg |
|---|---|
| Dimensions | 2.1 × 1.78 cm |
