Digi International XBee3 2.4GHz ZigBee 3.0 Module w/ PCB Antenna
The Digi International XBee3 is a versatile 2.4GHz wireless module featuring the Silicon Labs EFR32MG SoC, supporting ZigBee 3.0, 802.15.4, DigiMesh, and BLE protocols. It operates from 2.1-3.6V and is programmable via MicroPython for edge computing applications.
Features
- Multi-Protocol SoC: Features the Silicon Labs EFR32MG for ZigBee 3.0, 802.15.4, DigiMesh, and Bluetooth Low Energy (BLE) connectivity, configurable via Digi International XCTU software.
- Integrated MicroPython Engine: Enables standalone programmable smart nodes without an external microcontroller, simplifying firmware development and edge logic.
- Robust RF Performance: Delivers up to +8 dBm transmit power with -103 dBm receiver sensitivity, supporting ranges up to 4000 ft (1200 m) line-of-sight.
- Comprehensive Security Suite: Incorporates Digi International TrustFence® with 128/256-bit AES encryption, providing layered security for device identity, data, and network communications.
- Flexible Hardware Interfaces: Offers UART, SPI, and I2C serial data interfaces plus 15 digital I/O and four 10-bit ADC inputs for sensor and peripheral integration.
Out of stock
The Digi International XBee3 module is a pre-certified, multi-protocol wireless transceiver built around the high-performance Silicon Labs EFR32MG System-on-Chip (SoC). Designed for scalable IoT device connectivity, it supports industry-standard protocols including ZigBee 3.0, 802.15.4, DigiMesh, and Bluetooth Low Energy, all selectable and configurable via the Digi International XCTU configuration tool. Its integrated MicroPython runtime environment allows developers to execute application logic directly on the module, enabling the creation of smart, low-power end nodes and gateways without requiring a separate host microcontroller.
Engineered for reliable operation in industrial and commercial environments, the module employs Direct Sequence Spread Spectrum (DSSS) for interference immunity and offers configurable RF output power up to +8 dBm. It features advanced power management with deep sleep currents as low as 1.7 µA, making it suitable for battery-powered remote sensing and telemetry applications. The module’s compact 13 x 19 mm micro form factor is available in through-hole, surface-mount, and RF pad variants, with this specific model featuring an integrated PCB antenna for simplified design-in.
Additional Information
| Weight | 0.06 kg |
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