Digi International XBee3 2.4GHz ZigBee 3.0 Module w/ PCB Antenna

Description

The Digi International XBee3 module is a pre-certified, multi-protocol wireless transceiver built around the high-performance Silicon Labs EFR32MG System-on-Chip (SoC). Designed for scalable IoT device connectivity, it supports industry-standard protocols including ZigBee 3.0, 802.15.4, DigiMesh, and Bluetooth Low Energy, all selectable and configurable via the Digi International XCTU configuration tool. Its integrated MicroPython runtime environment allows developers to execute application logic directly on the module, enabling the creation of smart, low-power end nodes and gateways without requiring a separate host microcontroller.

Engineered for reliable operation in industrial and commercial environments, the module employs Direct Sequence Spread Spectrum (DSSS) for interference immunity and offers configurable RF output power up to +8 dBm. It features advanced power management with deep sleep currents as low as 1.7 µA, making it suitable for battery-powered remote sensing and telemetry applications. The module’s compact 13 x 19 mm micro form factor is available in through-hole, surface-mount, and RF pad variants, with this specific model featuring an integrated PCB antenna for simplified design-in.