Teledyne Teledyne FLIR Hadron 640R Qualcomm RB5 Test Kit, 640x512 LWIR + 64MP EO Dual Camera
The Teledyne Teledyne FLIR Hadron 640R is a dual-sensor development kit integrating a 640×512 LWIR radiometric thermal camera and a 64MP visible EO sensor, optimized for the Qualcomm RB5 platform for rapid AI and edge vision prototyping in robotics, drones, and industrial inspection.
Features
- Dual-Sensor Imaging: Combines a 640×512 LWIR radiometric thermal camera with a 64MP visible sensor for high-resolution thermal and EO data.
- Qualcomm RB5 Optimized: Pre-configured for seamless integration with the Qualcomm RB5 development platform, accelerating AI and computer vision application development.
- Radiometric Thermal: Provides precise temperature measurement data for analytics, enabling applications in predictive maintenance and condition monitoring.
- Compact SWaP Design: Features a small form factor and low-power 5V operation, ideal for deployment in drones, robotics, and embedded edge systems.
- High-Speed Interface: Supports MIPI CSI and USB 3.0 interfaces for high-bandwidth data transfer, with frame rates up to 60Hz for real-time processing.
Out of stock
The Teledyne Teledyne FLIR Hadron 640R Qualcomm RB5 Test Kit is a professional-grade development platform designed for advanced imaging and edge AI applications. It merges a high-resolution 640×512 LWIR thermal imager with radiometric capabilities and a 64MP electro-optical (EO) sensor into a single, compact module. This dual-camera system delivers synchronized thermal and visible data streams, enabling sophisticated computer vision algorithms for temperature analysis, object detection, and scene understanding.
Engineered for the Qualcomm RB5 robotics and IoT platform, the kit provides a streamlined hardware and software pipeline for developers. Its low-power 5V operation and SWaP-optimized design make it suitable for integration into mobile and resource-constrained environments like drones, autonomous robots, and portable inspection devices. The combination of MIPI CSI and USB 3.0 interfaces ensures flexible connectivity and high-speed data throughput for real-time processing at the edge.
Additional Information
| Weight | 6 kg |
|---|---|
| Dimensions | 9 × 11 × 7 cm |












