Description
The Boson+ 640 thermal camera module represents a significant advancement in accessible, high-performance LWIR imaging cores for OEMs and system integrators. Its 12µm pixel pitch sensor operates in the 8–14 µm spectral range, capturing detailed thermal data even in low-contrast environments. Advanced on-board image processing, including automatic gain control (AGC) and dynamic detail enhancement (DDE+), ensures output imagery maintains sharpness and clarity for improved machine vision algorithms or operator interpretation.
Engineered for harsh operational conditions, the module functions reliably across an extended temperature range of -40°C to 80°C. Its compact, lightweight form factor and versatile digital interfaces allow for straightforward integration into drones for aerial thermography, robotic platforms for autonomous navigation, handheld devices for predictive maintenance, and fixed surveillance systems for perimeter monitoring. The module’s design prioritizes low power draw and minimal thermal footprint, making it a practical choice for battery-powered and space-constrained applications requiring persistent thermal awareness.
Reviews
There are no reviews yet.