SOI JX-Q03P-C1-M3 CSP Image Sensor ROHS
The SOI JX-Q03P-C1-M3 is a CSP (Chip Scale Package) image sensor module designed for compact, high-performance imaging applications. It features a 1280H x 720V active pixel array and operates over a wide industrial temperature range, making it suitable for integration into embedded vision systems, IoT devices, and portable electronics.
Features
- 1.4μm x 5μm pixel size for detailed image capture
- 1280 x 720 (720p) active pixel resolution
- Chip Scale Package (CSP) for compact, space-saving designs
- Wide operating temperature range from -40°C to +85°C
- ROHS compliant for environmental safety
Out of stock
The JX-Q03P-C1-M3 is a CMOS-based CSP image sensor from SOI, engineered to deliver reliable visual data capture in constrained environments. Its Chip Scale Package minimizes the module footprint, enabling direct integration onto densely populated PCBs for applications like machine vision, biometric authentication, and mobile device cameras.
With a native resolution of 1280H x 720V and a pixel architecture optimized for sensitivity, this sensor provides a balance of detail and light-gathering capability. The extended industrial temperature rating ensures stable performance in challenging conditions, from outdoor monitoring to automotive interior systems.
Additional Information
| Weight | 0.01 kg |
|---|---|
| Dimensions | 10 × 8 × 3 cm |
