Alinx ACU15EG SoM AMD Zynq UltraScale+ MPSoC XCZU15EG
The Alinx ACU15EG SoM is a high-performance System-on-Module built around the AMD Zynq UltraScale+ XCZU15EG MPSoC, integrating quad-core Cortex-A53 application processors, dual-core Cortex-R5 real-time units, and 16nm FPGA fabric. It’s engineered for compute-intensive AI, vision, and industrial IoT applications requiring heterogeneous processing and hardware acceleration.
Features
- Heterogeneous Processing: Combines quad-core ARM Cortex-A53 (up to 1.3 GHz) for general-purpose computing with dual-core Cortex-R5 (up to 533 MHz) for deterministic real-time tasks.
- Integrated FPGA Fabric: Features 16nm FinFET+ programmable logic (PL) for custom hardware acceleration, signal processing, and high-speed I/O interfacing.
- High-Speed Memory: Equipped with 4 GB DDR4 SDRAM for the processing system (PS) and 2 GB DDR4 for the programmable logic (PL), ensuring ample bandwidth for complex algorithms.
- Onboard Storage: Includes 8 GB eMMC Flash for the operating system and applications, plus 64 MB QSPI Flash for configuration and boot images.
- Industrial Ruggedness: Operates across an extended temperature range of -40°C to +85°C, making it suitable for harsh automotive and industrial environments.
Out of stock
The Alinx ACU15EG System-on-Module (SoM) delivers a complete, production-ready embedded computing platform centered on the AMD Zynq UltraScale+ XCZU15EG Multiprocessor System-on-Chip. This architecture seamlessly blends high-performance application processing, real-time control, and customizable FPGA logic into a single, compact 80mm x 60mm module. The integrated Mali-400MP2 GPU provides additional graphics processing capability for human-machine interfaces or lightweight vision workloads.
Designed for rapid system integration, the module comes pre-populated with high-speed DDR4 memory, eMMC, and QSPI flash, significantly reducing design complexity and time-to-market. The board-to-board connector interface exposes the extensive I/O capabilities of the MPSoC, including high-speed transceivers, GPIOs, and peripheral interfaces, allowing developers to focus on creating custom carrier boards for their specific application domain, from 5G infrastructure to autonomous driving systems.
Additional Information
| Weight | 0.8 kg |
|---|---|
| Dimensions | 8 × 6 cm |
