Teledyne FLIR Lepton Thermal Imaging Camera Breakout Board V2

Description

The Teledyne FLIR Lepton Thermal Imaging Camera Breakout Board V2 serves as a critical interface adapter, enabling developers and system integrators to seamlessly incorporate Teledyne FLIR’s miniature Lepton thermal imaging cores into their prototypes and products. The board handles all essential power sequencing and signal conditioning, accepting a broad 3V to 5.5V DC input and providing clean, regulated 1.2V and 2.8V rails via its dual low-noise LDOs.

Engineered for flexibility, the breakout provides direct access to the Lepton module’s SPI and I²C communication buses and includes a 25 MHz reference clock. Strategic jumpers allow designers to bypass the onboard power supplies and clock, offering greater control for advanced or custom hardware integration. The compact footprint and robust 32-pin Molex socket make it ideal for embedding into space-constrained, mobile, or industrial IoT applications requiring thermal sensing.