Teledyne FLIR Lepton Thermal Imaging Camera Breakout Board V2
The Teledyne FLIR Lepton Thermal Imaging Camera Breakout Board V2 is a compact interface board designed to simplify the integration of Teledyne FLIR Lepton thermal camera cores into embedded systems and development platforms like Raspberry Pi, Arduino, and custom hardware, featuring onboard power regulation and SPI/I²C interfaces.
Features
- Universal compatibility with all Teledyne FLIR Lepton thermal imaging camera modules for flexible project integration.
- Compact 29.5 mm × 29.0 mm PCB with onboard dual low-noise LDOs for 1.2V core and 2.8V camera power.
- Provides direct access to SPI and I²C camera interfaces and a 25 MHz reference clock for stable operation.
- Features a 32-pin Molex socket and jumper-selectable bypass for power, clock, and power-up sequencing.
- Wide 3V to 5.5V input range supports deployment with various microcontrollers, SBCs, and battery packs.
Out of stock
The Teledyne FLIR Lepton Thermal Imaging Camera Breakout Board V2 serves as a critical interface adapter, enabling developers and system integrators to seamlessly incorporate Teledyne FLIR’s miniature Lepton thermal imaging cores into their prototypes and products. The board handles all essential power sequencing and signal conditioning, accepting a broad 3V to 5.5V DC input and providing clean, regulated 1.2V and 2.8V rails via its dual low-noise LDOs.
Engineered for flexibility, the breakout provides direct access to the Lepton module’s SPI and I²C communication buses and includes a 25 MHz reference clock. Strategic jumpers allow designers to bypass the onboard power supplies and clock, offering greater control for advanced or custom hardware integration. The compact footprint and robust 32-pin Molex socket make it ideal for embedding into space-constrained, mobile, or industrial IoT applications requiring thermal sensing.
Additional Information
| Weight | 0.008 kg |
|---|---|
| Dimensions | 8 × 8 × 2 cm |
