Raise3D DF2 DLP 3D Printer with Wash & Cure

The RFID workflow ensures seamless integration and traceability across the print, wash, and cure stages. It automates settings, minimizes human error, and guarantees consistent, repeatable results, which is crucial for industrial applications and quality control processes.

The Raise3D DF2 features an open material platform, supporting a wide range of high-performance resins including Raise3D's own formulations (Standard White, High Detail Apricot, Tough 2K Grey, Rigid 3K Grey, High Clear). It also supports collaborations with partners like Henkel and Forward AM.

Air-Peel technology significantly reduces the separation force required to detach a printed layer from the FEP film. This minimizes stress on the part, prevents delamination, and improves overall layer adhesion and structural integrity, leading to a higher first-print success rate.

The Raise3D DF2 offers a generous print volume of 200 mm (Length) × 112 mm (Width) × 300 mm (Height). This allows for the production of larger, more complex single components or multiple smaller parts in a single build, maximizing throughput.

Yes, the Raise3D DF2 is engineered with a robust Z-axis structure rated for a 200 kg static load. This allows the printer to reliably support and precisely fabricate parts weighing up to 10 kg, making it suitable for industrial applications with substantial components.