SKU: IOWC-0631
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Teledyne Teledyne FLIR Boson+ 22320A012-6PAAX Thermal Camera Module, 320×256 LWIR, 18mm Lens

₹502,859.00 (Inclusive of all taxes)
Out of Stock

The Teledyne Teledyne FLIR Boson+ is a high-performance OEM thermal imaging core delivering 320×256 LWIR resolution with ≤20 mK sensitivity at up to 60 Hz. Its compact design and multiple interfaces (USB, MIPI, CMOS) enable integration into drones, robotics, and industrial monitoring systems.

Features

  • High-resolution 320×256 LWIR thermal imaging with ≤20 mK sensitivity for precise temperature detection.
  • Ultra-compact and lightweight 7.5g core optimized for SWaP-constrained drone and robotics applications.
  • Multiple video output interfaces including USB, MIPI, and CMOS for flexible system integration.
  • Advanced image processing with AGC and DDE+ technologies for enhanced contrast and clarity.
  • Wide operating temperature range from -40°C to 80°C for reliable performance in harsh environments.

Out of stock

Description

The Teledyne Teledyne FLIR Boson+ thermal camera module is a longwave infrared (LWIR) imaging core engineered for OEM integration. It provides high-fidelity thermal vision with a resolution of 320×256 pixels and a thermal sensitivity of ≤20 mK, enabling the detection of minute temperature differences. The module operates at up to 60 Hz with low latency, making it suitable for real-time tracking and decision-making applications.

Designed with size, weight, and power (SWaP) optimization, the Boson+ weighs just 7.5g and features a compact 21×21×11 mm form factor. It supports a comprehensive suite of control and video interfaces, including UART, I2C, SPI, USB, MIPI, and CMOS, allowing for seamless integration into embedded systems. Its robust construction ensures reliable operation across an extended temperature range from -40°C to 80°C, suitable for industrial, surveillance, and outdoor use.

Key Features

  • Ultra-high thermal sensitivity (≤20 mK) for detecting minute temperature variations.
  • Compact, lightweight OEM core optimized for drones, handheld devices, and robotics.
  • Advanced Automatic Gain Control (AGC) and Dynamic Detail Enhancement (DDE+) for superior image contrast.
  • Multiple digital interface options: USB Video Class (UVC), MIPI CSI-2, and parallel CMOS video output.
  • Low-latency, 60 Hz frame rate enables real-time monitoring and tracking.
  • Wide operating temperature range (-40°C to 80°C) for harsh environment reliability.
  • NDAA compliant and ITAR-free design simplifies global deployment and integration.
  • Integrated 18mm lens provides a narrow field of view for detailed, long-range imaging.

Applications

  • Drone-based thermal inspection for infrastructure, agriculture, and search & rescue.
  • Robotics and autonomous vehicle navigation and obstacle detection.
  • Handheld thermal imaging devices for building diagnostics and maintenance.
  • Industrial process monitoring and predictive maintenance systems.
  • Surveillance and security systems for perimeter monitoring.

Technical Specifications

Sensor Resolution320 × 256 pixels
Thermal Sensitivity (NEdT)≤20 mK
Frame RateUp to 60 Hz
Spectral Range8 µm – 14 µm (LWIR)
Lens18mm (Narrow FOV)
Digital Zoom1x to 8x
Supply Voltage3.3V DC
Power Consumption~600 mW (min)
InterfacesUART, I2C, USB, SPI, MIPI, CMOS
Operating Temperature-40°C to 80°C
Dimensions (without lens)21 × 21 × 11 mm
Weight (without lens)7.5g

Frequently Asked Questions

What interfaces does the Boson+ module support for video output and control?

The Boson+ provides multiple interface options for system integration. For video streaming, it supports USB Video Class (UVC), MIPI CSI-2, and parallel CMOS output. For configuration and control, it offers UART, I2C, and SPI serial communication buses. This flexibility allows developers to connect the module to single-board computers like Raspberry Pi (via MIPI), embedded Linux systems (via USB), or custom microcontrollers using the serial protocols.

What is the power requirement and typical consumption of the Boson+ thermal core?

The module requires a 3.3V DC power supply. Its typical power consumption is approximately 600 milliwatts under normal operating conditions. This low power draw, combined with its compact size and weight, makes it particularly suitable for battery-powered and SWaP-constrained applications such as unmanned aerial vehicles (UAVs), portable inspection tools, and wearable systems where efficient power management is critical for extended operational runtime.

How do I integrate the Boson+ module with a Raspberry Pi or similar SBC?

For Raspberry Pi integration, the recommended method is using the MIPI CSI-2 interface. You will need a compatible MIPI adapter cable and must enable the CSI camera interface in the Raspberry Pi OS configuration. Teledyne FLIR provides a Software Development Kit (SDK) and drivers for Linux platforms to facilitate image capture and camera parameter control. For prototyping, the USB interface offers a plug-and-play solution using standard UVC drivers, allowing quick setup on any host supporting USB video.

What software and SDKs are available for developing with this Teledyne FLIR module?

Teledyne Teledyne FLIR offers the Boson Software Development Kit (SDK) for application development. This SDK includes libraries, APIs, and sample code for Windows and Linux platforms, supporting control over camera functions, image acquisition, and integration of the advanced AGC and DDE+ processing features. For embedded systems, low-level communication is handled via the documented serial command set over UART or I2C, allowing full customization of the thermal imaging pipeline within your firmware.

Package Includes

  • 1 x Teledyne Teledyne FLIR Boson+ 22320A012-6PAAX Thermal Camera Module

Additional Information

Weight 0.02 kg
Dimensions 2.1 × 2.1 × 1.1 cm