Teledyne Teledyne FLIR Boson+ 22320H092-6PAAX Radiometric Thermal Camera Module, 320×256 LWIR, 92° HFOV, 2.3mm Lens
The Teledyne Teledyne FLIR Boson+ 22320H092-6PAAX is a high-performance, long-wave infrared (LWIR) thermal imaging core module featuring 320×256 resolution, ≤20 mK sensitivity, and a 92° HFOV. Designed for OEM integration, it supports USB, CMOS, and MIPI interfaces for seamless connection to embedded platforms like Qualcomm and NVIDIA, enabling advanced thermal sensing in drones, robotics, and industrial systems.
Features
- High-Resolution Radiometric Imaging: 320 x 256 pixel LWIR sensor with ≤20 mK thermal sensitivity (NEdT) for precise temperature measurement and exceptional image clarity in low-contrast scenes.
- Wide-Angle Field of View: Ultra-wide 92° horizontal field of view (HFOV) with a fixed 2.3mm f/1.0 lens provides maximum scene coverage for surveillance, drones, and robotics.
- High-Speed, Low-Latency Output: Default 60Hz frame rate (30Hz selectable) with advanced AGC and DDE+ image processing ensures sharp contrast and real-time tracking for dynamic applications.
- Compact, Low-Power OEM Core: Ultra-compact 21x21x11mm form factor and power consumption as low as 600 mW minimize system SWaP (Size, Weight, and Power) for embedded integration.
- Flexible Integration Interfaces: Supports multiple video outputs (USB, CMOS, MIPI) and control interfaces (UART, I2C, USB) for compatibility with a wide range of host processors and development platforms.
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The Teledyne Teledyne FLIR Boson+ 22320H092-6PAAX represents a cutting-edge OEM thermal imaging core engineered for demanding embedded vision applications. Its 320×256 microbolometer array operates in the 8-14 µm long-wave infrared (LWIR) spectrum, capturing detailed heat signatures with industry-leading sensitivity of ≤20 mK. This enables reliable detection, recognition, and identification of objects and anomalies even in challenging environmental conditions.
Architected for minimal latency and high throughput, the module leverages Teledyne FLIR’s proprietary DDE+ image processing and Silent Shutterless NUC (SSN™) technology to deliver stable, high-contrast video feeds without the motion artifacts of mechanical shutters. The combination of a wide 92° field of view, digital zoom up to 8x, and a dynamic range up to 350°C makes it exceptionally versatile for scenarios requiring broad area monitoring or focused inspection.
Designed with system integrators in mind, the Boson+ core supports a suite of standard digital interfaces—including USB for direct connectivity, CMOS for parallel data, and MIPI CSI-2 for streamlined integration with modern SoCs. Its robust -40°C to +80°C operating temperature range and low 3.3V DC power requirement ensure reliable performance in outdoor, mobile, and industrial environments, from autonomous drones to predictive maintenance systems.
Additional Information
| Weight | 0.0075 kg |
|---|---|
| Dimensions | 2.1 × 2.1 × 1.1 cm |
