SKU: IOWC-0629
📋 GST Invoice Available

Teledyne Teledyne FLIR Boson+ 640×512 LWIR Thermal Camera Module, 95° HFOV, 4.9mm Lens

₹736,439.00 (Inclusive of all taxes)
Out of Stock

The Teledyne Teledyne FLIR Boson+ 22640AS95-6PAAX is a high-performance longwave infrared (LWIR) thermal imaging core module, featuring a 640×512 resolution sensor with ≤20 mK sensitivity and a 95° HFOV 4.9mm lens. Designed for OEM integration, it provides low-latency, 60Hz video output via USB, MIPI, or CMOS interfaces for real-time thermal vision applications in drones, robotics, and surveillance systems.

Features

  • High-Resolution Thermal Imaging: 640×512 pixel LWIR sensor delivers detailed thermal maps with exceptional ≤20 mK (NEdT) thermal sensitivity for detecting minute temperature differences.
  • Wide-Angle Field of View: Integrated 4.9mm f/1.0 lens provides a 95° horizontal field of view (HFOV), ideal for broad-area surveillance and inspection.
  • Real-Time Performance: Operates at a 60Hz frame rate with ultra-low latency output, enabling responsive tracking and analysis for dynamic applications.
  • Flexible OEM Integration: Supports multiple video (CMOS, MIPI, USB) and control (UART, I2C, USB) interfaces for seamless embedding into custom hardware platforms.
  • Compact & Low Power: Ultra-compact 21x21x11 mm core module weighs just 7.5g and consumes from ~1000 mW, suitable for portable and airborne systems.

Out of stock

Description

The Boson+ 640 thermal camera module represents a significant advancement in accessible, high-performance LWIR imaging cores for OEMs and system integrators. Its 12µm pixel pitch sensor operates in the 8–14 µm spectral range, capturing detailed thermal data even in low-contrast environments. Advanced on-board image processing, including automatic gain control (AGC) and dynamic detail enhancement (DDE+), ensures output imagery maintains sharpness and clarity for improved machine vision algorithms or operator interpretation.

Engineered for harsh operational conditions, the module functions reliably across an extended temperature range of -40°C to 80°C. Its compact, lightweight form factor and versatile digital interfaces allow for straightforward integration into drones for aerial thermography, robotic platforms for autonomous navigation, handheld devices for predictive maintenance, and fixed surveillance systems for perimeter monitoring. The module’s design prioritizes low power draw and minimal thermal footprint, making it a practical choice for battery-powered and space-constrained applications requiring persistent thermal awareness.

Key Features

  • Ultra-high-resolution 640×512 microbolometer array for detailed longwave infrared imaging.
  • Exceptional thermal sensitivity (NEdT ≤20 mK) for detecting subtle temperature variations.
  • High-speed 60 Hz frame rate (30 Hz selectable) enables real-time video capture and analysis.
  • Wide 95° horizontal field of view via a fixed 4.9mm f/1.0 germanium lens.
  • Advanced on-chip image processing with AGC and DDE+ for enhanced contrast and sharpness.
  • Multiple digital video output interfaces: standard CMOS, MIPI CSI-2, and USB for flexible system design.
  • Comprehensive control via UART, I2C, or USB for configuration, calibration, and command.
  • NDAA compliant and ITAR-free design for broader commercial and international deployment.

Applications

  • Aerial Thermography & Drone Inspection: Mount on UAVs for solar panel inspection, building heat loss analysis, and search & rescue operations.
  • Robotics & Autonomous Navigation: Provide thermal vision for obstacle avoidance, person detection, and environmental mapping in low-light or smoky conditions.
  • Industrial Predictive Maintenance: Integrate into handheld or fixed systems to monitor electrical components, mechanical systems, and process equipment for overheating.
  • Security & Surveillance: Enable 24/7 perimeter monitoring, intrusion detection, and fire spotting regardless of lighting conditions.
  • Scientific Research & Development: Serve as a core imaging component in laboratory setups for thermal analysis, material testing, and biological studies.

Technical Specifications

Sensor Resolution640 × 512 pixels
Thermal Sensitivity (NEdT)≤ 20 mK
Spectral Range8 µm – 14 µm (LWIR)
Frame Rate60 Hz (30 Hz selectable)
Horizontal Field of View (HFOV)95°
Lens Specification4.9 mm, f/1.0
Pixel Pitch12 µm
Digital Zoom1x to 8x
Supply Voltage3.3 VDC
Power ConsumptionStarting from ~1000 mW
Video InterfacesCMOS, MIPI CSI-2, USB
Control InterfacesUART, I2C, USB
Operating Temperature-40°C to +80°C
Module Dimensions (excl. lens)21 × 21 × 11 mm
Module Weight (excl. lens)7.5 g

Frequently Asked Questions

What interfaces does the Boson+ module support for video output and system control?

The module provides flexible digital video outputs including a standard CMOS parallel interface, a MIPI CSI-2 serial lane, and a USB Video Class (UVC) endpoint for direct PC connection. For control and configuration, it offers a UART serial port for AT-style commands, an I2C bus for register access, and full configurability over its USB interface. This multi-interface design allows integration with embedded Linux SBCs, custom FPGA platforms, or direct connection to host computers for application development.

How do I power and achieve the lowest power consumption with this thermal camera module?

Supply a stable 3.3 VDC power source to the module's designated input pins, ensuring sufficient current capability for peak loads. Power consumption starts from approximately 1000 mW but varies with frame rate, interface activity, and processing load. To minimize power, utilize the module's configurable low-power states via the UART or I2C command set, which may involve reducing the frame rate to 30 Hz or disabling certain on-chip processing features when maximum performance is not required for your specific application scenario.

Can I replace the integrated 4.9mm lens, and what is its field of view specification?

No, the 4.9mm f/1.0 germanium lens is factory-integrated and sealed as part of the Boson+ core module assembly; it is not user-replaceable or interchangeable. This lens provides a wide 95-degree horizontal field of view (HFOV), which is ideal for applications requiring broad-area coverage such as drone-based surveying or wide-angle surveillance. The fixed focal length and fast f/1.0 aperture are optimized for the sensor's 12µm pixel pitch to maximize thermal signal collection.

What software or SDK is available for developing applications with the Boson+ module?

Teledyne Teledyne FLIR provides the Boson Software Development Kit (SDK) and associated documentation for application development. The SDK includes libraries for communicating with the module over USB, UART, and I2C, enabling control of camera parameters, image streaming, and calibration functions. For the MIPI and CMOS interfaces, you will need to implement the low-level driver for your host processor, referencing the module's electrical and timing specifications provided in the detailed hardware integration guide from Teledyne FLIR.

Package Includes

  • 1 x Teledyne Teledyne FLIR Boson+ 22640AS95-6PAAX Thermal Camera Module (640×512 LWIR, 95° HFOV, 4.9mm Lens)

Additional Information

Weight 0.015 kg
Dimensions 5 × 5 × 2 cm