NXP Semiconductors FXOS8700CQEVB 6-Axis Sensor Evaluation Board with Headers

Name: NXP Semiconductors FXOS8700CQEVB 6-Axis Sensor Evaluation Board with Headers
Brand: NXP Semiconductors
SKU: SENS-4250
Price: 1203.00 INR
Availability: OutOfStock

₹1,203.00 (Inclusive of all taxes)

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The NXP Semiconductors FXOS8700CQEVB evaluation board integrates a 3-axis accelerometer and 3-axis magnetometer into a single QFN package, providing a complete 6-axis e-Compass solution. It operates from 1.95–3.6V VDD with I²C or SPI digital interfaces, making it compatible with microcontrollers like Arduino, Raspberry Pi, and STM32 for rapid prototyping of motion and orientation sensing applications.

Features

Integrated 3-axis accelerometer (±2g/±4g/±8g) and 3-axis magnetometer (±1200 µT)
Dual digital interfaces: I²C (up to 400 kHz) and SPI (up to 10 MHz)
Selectable power supply: 1.95–3.6V VDD, 1.62–3.6V VDDIO
Programmable data rates from 1.563 Hz to 800 Hz per sensor
On-chip FIFO and programmable event detection (freefall, pulse, orientation)

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Description

The FXOS8700CQ sensor combines a MEMS capacitive accelerometer and a planar Hall-effect magnetometer, enabling precise measurement of linear acceleration and magnetic field Vector Technics. The integrated sensor fusion algorithms provide calibrated 6-axis data, reducing system-level calibration overhead. The evaluation board provides a breakout for all sensor pins, including interrupt lines, for immediate integration into prototype systems.

Designed for low-power operation, the sensor features multiple power modes and an intelligent wake-on-motion function, making it suitable for battery-powered wearable devices and IoT nodes. The robust QFN package is rated for operation from –40 °C to +85 °C, ensuring reliable performance in demanding environmental conditions.

Key Features

Complete 6-axis e-Compass solution with integrated accelerometer and magnetometer.
High-resolution digital output with low noise density for precise motion tracking.
Flexible digital communication via selectable I²C or SPI bus interfaces.
Advanced programmable features including freefall, pulse, and orientation detection.
On-chip 32-sample FIFO buffer for efficient data management and host processor load reduction.
Wide operating voltage range supports mixed-logic voltage systems (1.62V to 3.6V I/O).
Extended industrial temperature range from –40 °C to +85 °C.
Evaluation board includes pre-soldered headers for rapid prototyping and testing.

Applications

Robotics and drone navigation for tilt-compensated compass and inertial measurement.
Wearable fitness trackers and smartwatches for activity and gesture recognition.
Mobile device screen orientation and context-aware applications.
Industrial equipment monitoring for vibration analysis and asset tracking.
Security systems for tamper detection and positional logging.

Technical Specifications

Manufacturer Part Number	FXOS8700CQEVB
Sensor Type	6-Axis (3-Axis Accelerometer + 3-Axis Magnetometer)
Acceleration Full-Scale Range	±2 g / ±4 g / ±8 g (Selectable)
Magnetic Full-Scale Range	±1200 µT
Supply Voltage (VDD)	1.95 V to 3.6 V
I/O Voltage (VDDIO)	1.62 V to 3.6 V
Digital Interface	I²C (up to 400 kHz), SPI (up to 10 MHz)
Output Data Rate (ODR)	1.563 Hz to 800 Hz (per sensor), Hybrid mode up to 400 Hz
Operating Temperature Range	–40 °C to +85 °C
Package	QFN
Board Dimensions (L x W)	80 mm x 40 mm
Board Weight	8 g

Frequently Asked Questions

What is the difference between VDD and VDDIO on the FXOS8700CQ board?

VDD (1.95–3.6V) powers the sensor core analog and digital circuitry. VDDIO (1.62–3.6V) powers the digital I/O pins for the I²C or SPI interface, allowing the board to interface with host microcontrollers using different logic voltage levels (e.g., 3.3V or 1.8V systems).

How do I select between the I²C and SPI communication interfaces?

The interface is selected via hardware pin configuration. The CS (Chip Select) pin must be pulled high to enable I²C mode (with the I²C address selectable via the SA0 pin). Pulling CS low activates the 4-wire SPI mode. The evaluation board includes breakout pads for these control pins.

What is the purpose of the on-chip FIFO buffer?

The 32-sample FIFO buffer stores acceleration and magnetic data, allowing the host processor to read data in bursts. This significantly reduces the host's polling overhead and enables power-saving sleep modes while the sensor continues to collect data, which is crucial for low-power IoT and wearable applications.

Can this sensor be used for vibration monitoring?

Yes, the accelerometer's configurable data rates up to 800 Hz and programmable event detection (like pulse) make it suitable for basic vibration monitoring and shock detection. For high-frequency vibration analysis, a dedicated accelerometer with a higher bandwidth would be recommended.