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Teledyne Teledyne FLIR Hadron 640R Qualcomm 865 Test Kit 421-0094-00

₹165,339.00 (Inclusive of all taxes)
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The Teledyne Teledyne FLIR Hadron 640R Test Kit is a dual-camera development platform integrating a 640×512 LWIR radiometric thermal sensor with a 64MP visible EO camera. Designed for OEMs, it provides a complete integration kit for AI and edge computing applications on Qualcomm Snapdragon 865 platforms.

Features

  • Dual-sensor imaging combines a high-resolution 640×512 LWIR thermal camera with a 64MP visible EO sensor for comprehensive scene analysis.
  • Optimized for the Qualcomm Snapdragon 865 platform, enabling rapid AI and computer vision application development for drones, robotics, and industrial systems.
  • Delivers radiometric thermal data for accurate temperature measurement and analysis, critical for predictive maintenance and inspection tasks.
  • Supports high-frame-rate imaging up to 60 Hz, suitable for dynamic, real-time vision processing in mobile and embedded applications.
  • Features a compact, SWaP-optimized design with 5V low-power operation for efficient integration into space- and power-constrained environments.

Out of stock

Description

The Teledyne Teledyne FLIR Hadron 640R Qualcomm 865 Test Kit (421-0094-00) is a professional-grade OEM development platform engineered for integrating advanced thermal and visual perception into next-generation systems. It pairs a high-performance 640×512 long-wave infrared (LWIR) microbolometer with a 64-megapixel electro-optical (EO) sensor, providing simultaneous radiometric thermal imaging and ultra-high-definition visible light capture. This dual-stream data fusion is ideal for developing sophisticated AI inference, object detection, and situational awareness algorithms.

Built around compatibility with the Qualcomm Snapdragon 865 system-on-chip, the kit offers a streamlined path for embedding high-frame-rate computer vision into mobile, robotic, and industrial IoT devices. Its architecture is designed for low-latency processing, supporting frame rates up to 60 Hz to handle fast-moving scenes. The compact, low-power form factor (5V operation) ensures the platform can be deployed in drones, autonomous vehicles, and portable inspection tools where size, weight, and power (SWaP) are critical constraints, significantly accelerating prototype-to-production cycles.

Key Features

  • Dual-camera system providing synchronized LWIR thermal and high-resolution visible imaging streams.
  • Radiometric thermal sensor capable of measuring absolute temperature values for precise analytics.
  • Seamless hardware and software integration with Qualcomm Snapdragon 865-based development boards and modules.
  • High-speed imaging pipeline supports up to 60 Hz frame rate for real-time video processing and analysis.
  • SWaP-optimized mechanical and electrical design for integration into mobile and embedded platforms.
  • Complete OEM development kit includes necessary hardware, software drivers, and documentation for rapid prototyping.
  • Enables advanced AI/ML workloads for object classification, anomaly detection, and predictive maintenance.

Applications

  • Drone and UAV-based thermal inspection for solar farms, power lines, and infrastructure.
  • Robotic vision systems for autonomous navigation, object manipulation, and industrial automation.
  • Industrial predictive maintenance and machine condition monitoring using thermal anomaly detection.
  • Advanced driver-assistance systems (ADAS) and autonomous vehicle perception stacks.
  • Portable diagnostic and inspection tools for security, search & rescue, and building diagnostics.

Technical Specifications

Thermal Sensor Resolution640 × 512 LWIR
Visible Sensor Resolution64 MP EO
Supported Processing PlatformQualcomm Snapdragon 865
Maximum Frame RateUp to 60 Hz
Power Supply5V DC (Low-power operation)
Primary InterfaceMIPI CSI-2 (Typical for Snapdragon integration)
Imaging CapabilityRadiometric (Temperature Measurement)
Kit TypeOEM Development & Test Kit

Frequently Asked Questions

What software development kits (SDKs) or APIs are provided with the Hadron 640R Test Kit for the Snapdragon 865?

The kit typically includes Teledyne FLIR's proprietary software libraries and drivers optimized for the Qualcomm Snapdragon 865 platform, providing low-level camera control, image capture, and radiometric data access. Developers use these APIs within the Snapdragon Neural Processing SDK or Qualcomm's Hexagon DSP framework to build computer vision and AI inference pipelines. Integration guides and sample code for object detection and temperature analysis are usually provided to accelerate application development on Android or embedded Linux environments.

How do I synchronize the thermal and visible image streams from the dual sensors for fused image processing?

The Hadron 640R kit's hardware and driver stack is designed to provide hardware-triggered synchronization of the thermal LWIR and 64MP EO sensor outputs. Using the provided MIPI CSI-2 interfaces, the Snapdragon 865's Image Signal Processor (ISP) can receive aligned frames. Developers can then utilize the Teledyne FLIR SDK to access timestamp-matched image pairs, enabling pixel-level fusion algorithms for tasks like overlaying thermal hotspots on high-resolution visual maps within your AI application.

What is the typical power consumption of the Hadron 640R camera module during active 60 Hz imaging?

While exact figures depend on configuration, the Hadron 640R is designed for low-power operation from a 5V supply, suitable for mobile and drone applications. At its maximum 60 Hz frame rate with both sensors active, expect higher current draw; precise consumption should be verified in the detailed datasheet. For power-sensitive designs, the SDK allows adjusting frame rate, resolution, and sensor on/off cycles to manage power budgets effectively during operation.

Package Includes

  • 1 x Teledyne Teledyne FLIR Hadron 640R Dual Thermal & Visible Camera Development Kit (421-0094-00)

Additional Information

Weight 6 kg
Dimensions 7 × 11 × 4 cm