Description
SUNLU PLA+ filament is engineered for enhanced performance, featuring advanced winding technology that ensures consistent, tangle-free extrusion and improved print efficiency. This material offers significantly upgraded mechanical properties, including drop resistance and an impressive impact strength of up to 8KJ/m², which is two to three times superior to conventional PLA. This makes it ideal for producing more resilient and robust 3D printed components.
Designed for optimal printability, this PLA+ formulation guarantees a clog-free, bubble-free, and warp-free printing experience, fostering exceptional layer adhesion and vibrant color saturation in every print. The filament maintains a stringent 1.75mm diameter with a tight tolerance of ±0.02mm, ensuring broad compatibility with the majority of FDM 3D printers. Recommended nozzle temperatures range from 210°C to 235°C, with a heated bed temperature of 55°C to 65°C, facilitating reliable bed adhesion and high-quality finishes.






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