MOS25 12-50V 25A Heat Bed Power Expansion Module
This MOS25 heat bed power expansion module enhances your 3D printer’s thermal control, supporting 12-50V input and up to 25A for stable and efficient heating. Featuring a large heatsink, it protects your mainboard from excessive current, ensuring reliable long-term operation.
Features
- Supports a wide 12V to 50V input voltage range for versatile compatibility.
- Integrates a unique snowflake heatsink for superior passive cooling performance.
- Ensures stable heat bed control with up to 25A continuous current capacity.
- Protects the controller board connectors from damage due to excessive current.
- Enables precise PID control for enhanced 3D printer heat bed temperature management.
Out of stock
The MOS25 Heat Bed Power Expansion Module is an essential upgrade for 3D printers requiring robust and precise heat bed control. Built around a powerful MOSFET, this module allows for advanced PID temperature management, a feature often unavailable with standard DC-DC relays. It effectively addresses the common issue of high current draw from heated beds, safeguarding your mainboard’s connectors from potential damage due to excessive load.
Designed for long-term stability, the MOS25 module can sustain up to 25A of current, making it suitable for a wide range of heated beds, especially those with power greater than 150W (when an external high power module is also considered). Its compatibility extends to various 3D printer motherboards, including popular setups like RAMPS 1.4, Anet A8, and Lerdge controller boards, offering a universal solution for enhanced thermal management and system longevity.
Additional Information
| Weight | 0.052 kg |
|---|---|
| Dimensions | 7 × 4.5 × 2 cm |
