eSUN PETG+ 1.75mm 3D Printer Filament – Red

1,249.00

eSUN PETG+ 1.75mm Red filament delivers superior mechanical performance, combining the strength and ductility of ABS with the ease of printing of PLA. This tough material boasts low shrinkage, excellent chemical resistance, and a smooth, often translucent finish, making it ideal for robust mechanical parts and functional prototypes on FDM 3D printers.

Out of stock

Description

The eSUN PETG+ 3D Filament is an advanced material that strategically combines the best characteristics of both ABS and PLA filaments, offering an easy-to-print solution with enhanced toughness and impressive heat resistance. Derived from Polyethylene terephthalate glycol-modified, PETG+ is renowned for its strength, water resistance, and the ability to produce parts with a beautiful, glossy finish. Its versatility has made it a highly popular choice in the 3D printing community, bridging the gap between common materials.

Printing with eSUN PETG+ is remarkably straightforward, almost as simple as PLA, yet it yields significantly stronger results. Users should ensure excellent first-layer adhesion, similar to PLA, to prevent material blob around the nozzle. The strong layer bonding inherent to PETG+ creates exceptionally robust end products that are more likely to bend under stress rather than break, offering a superior mechanical profile compared to brittle alternatives. While PETG+ exhibits good hydrophobicity, minimizing water absorption, printing in a well-ventilated area is recommended despite its almost odorless nature. For optimal results, a heated bed set to 80-90°C is advisable, though the material’s low shrinkage allows for printing without one. Optimal extrusion temperature typically ranges from 230-250°C, with 245°C often being the sweet spot for minimal stringing and superior adhesion.

Additional information

Weight 1.6 kg
Dimensions 22 × 22 × 8 cm

Reviews

There are no reviews yet.

Be the first to review “eSUN PETG+ 1.75mm 3D Printer Filament – Red”

Your email address will not be published. Required fields are marked *