CM4 Heatsink for Raspberry Pi Compute Module 4

Description

Efficient thermal management is crucial for maintaining the performance and longevity of the Raspberry Pi Compute Module 4 (CM4), especially under heavy workloads. This specialized CM4-HEATSINK is engineered from high-grade aluminum to significantly increase the heat flow away from the CM4’s processor and other hot components. By expanding the surface area and promoting convective cooling, it ensures your CM4 operates within optimal temperature ranges.

Testing has shown this heatsink can reduce core temperatures by approximately 11°C compared to a bare CM4 board, depending on environmental conditions and specific application loads. Its robust design features 7 rows and 14 columns of fins, maximizing the thermal interface and cooling efficiency. Installation is straightforward, mounting directly onto the BGA chip, and its compact form factor ensures compatibility with a wide range of Raspberry Pi cases.