BIQU H2C PyroGrip High-Temperature Build Plate
The BIQU H2C PyroGrip Build Plate offers exceptional high-temperature adhesion and easy print removal for demanding engineering filaments. Its durable 336 x 343 mm surface ensures stable, warp-free printing and consistent performance.
Features
- High-temperature PyroGrip surface for advanced engineering filaments.
- Superior first-layer adhesion, preventing warping at elevated bed temperatures.
- Effortless print removal once the build plate cools.
- Durable coating designed for repeated, high-temperature printing cycles.
Out of stock
The BIQU H2C PyroGrip Build Plate is engineered for reliable printing with high-temperature and engineering-grade filaments. Its specialized PyroGrip surface maintains exceptional first-layer adhesion even at elevated bed temperatures, reducing warping and improving print stability for demanding applications. Designed to withstand repeated heating cycles, the durable coating offers excellent wear resistance while ensuring consistent printing performance over time.
The optimized surface allows printed parts to release easily after cooling, minimizing the need for scrapers or adhesives. Ideal for advanced users and professionals, the PyroGrip Build Plate supports precision printing with materials that require higher bed temperatures while delivering clean bottom-layer finishes. Whether producing functional prototypes, industrial components, or durable mechanical parts, this build plate provides dependable adhesion, long-lasting durability, and a smooth printing experience for high-performance FDM 3D printing.
Additional Information
| Weight | 0.463 kg |
|---|---|
| Dimensions | 34.3 × 33.6 × 0.1 cm |
