Thermal Conductive Silica Gel Pad - 10x10x6mm
This thickened thermal conductive silica gel pad provides efficient heat transfer between ICs and heatsinks. With a 10x10x6mm dimension, it ensures robust thermal management for various electronic components up to 200°C.
Features
- Features 6.0 W/mK thermal conductivity for highly efficient heat dissipation.
- Maintains stable performance across a wide temperature range from -40°C to 200°C without melting.
- Electrically insulating, ensuring safe contact with active electrical traces without causing damage.
- Designed with softness and elasticity to conform to imperfect surfaces for optimal thermal contact.
Out of stock
This thickened thermal conductive silica gel pad is engineered to facilitate efficient heat transfer from integrated circuits (ICs) and other heating electronic components to their respective heatsinks or metal enclosures. Its primary function is to bridge microscopic air gaps and surface imperfections, thereby maximizing thermal contact and reducing thermal resistance.
Crafted from high-quality silica gel, the pad exhibits remarkable softness and elasticity, allowing it to conform seamlessly to irregular surfaces. This ensures consistent and reliable heat conduction, significantly improving the operational efficiency and extending the service life of critical electronic hardware by maintaining optimal operating temperatures.
Additional Information
| Weight | 0.002 kg |
|---|---|
| Dimensions | 1 × 1 × 0.6 cm |
